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XMOD Technologies (Shanghai) is without business partnership with CMP, therefore, no direct access to CMP MPW resource. However,  most of the CMP resource is overlapped with MOSIS/ICC/IHP  except ST microelectronics resource.  If customer is with interest on above foundries' process, please contact XMOD Technologies (shanghai). As a french  owned company,  XMOD Technologies is with direct contact window to CMP in  France and on the way to share resource with each other.


关于CMP:
CMP is a service organization in ICs and MEMS for prototyping and low volume production. Circuits are fabricated for Universities, Research Laboratories and Industrial companies.
Advanced industrial technologies are available in CMOS, SiGe BiCMOS, HV-CMOS, SOI, P-HEMT GaAs, MEMS, 3D-IC, etc. CMP distributes and supports several CAD software tools for both Industrial Companies and Universities.

Since 1981, more than 1000 Institutions from 70 countries have been served, more than 6700 projects have been prototyped through 800 runs, and 60 different technologies have been interfaced.





The nominal turnaround time, from the closing date of the run to the delivery of packaged chips was:

 CMOS 11 weeks

 HV CMOS 12 weeks

 SiGe BiCMOS 13 weeks

 Advanced CMOS 16 - 20 weeks

Including 1-2 weeks data preparation and 2-3 weeks wafer dicing and packaging

MPW schedule:

Note:

Further MPW runs will be announced in CMOS28FDSOI, BiCMOS9MW, and HCMOS9GP.

Dates of S28I14_3 and of S28I14_4 will be updated in mid-2014.

For ST runs, it is mandatory to send a reservation request at least one month before the deadline.

For AMS runs, it is mandatory to send a reservation request at least one week before the deadline.


MPW price:

Generalities

Price per mm2 of the current price list is for 25 bare dies except for MEMSCAP.
Additional dies are charged.


DRC

Price includes DRC checking made by CMP before fabrication.
In case of DRC errors CMP will contact you for corrections.
Send your circuit layout before the deadline to have time for corrections.


Charged area

There is a minimum charge for each circuit depending on the technology process. This charge is defined as a minimum area.
Excepted for MEMSCAP the charged area includes a seal ring of 120µm added by CMP around the circuit (240µm added in X and in Y axis).
The seal ring is not charged when the circuit area is smaller or equal to the minimum.


Examples for circuits in C35B4C3 technology of ams

  • The circuit size is 1500µm x 1600µm (limit of pad ring), you are charged of the minimum area, 3mm2.
    3.00mm2 * 650 Euro/mm2 = 1950 Euro.
  • The circuit size is 3000µm x 3000µm (limit of pad ring), you are charged of
    (3000µm + 240µm) * (3000µm + 240µm) = 10.50mm2.
    10.50mm2 * 650 Euro/mm2 = 6825 Euro.

Packaging

Packaging must be ordered in the CMP Order Form before the deadline of the run.
The bonding diagram must be sent with the CMP Order Form.
Please check technical constraints on pad ring and the price list.


Additional circuits

Additional circuits must be ordered before the deadline.
Price is determined on a case per case basis.


Colour plots

Colour plots must be ordered before the deadline.
Default format is around A0 (115cm x 76cm).
Price: 35 Euro for the first sample and 20 Euro per copy.


Shipment fees

Depending on destination shipment fees for circuits and for plots are charged with an amount of 60 Euro to 150 Euro.



Prices 2014
ams(5) 0.18u CMOS C18A6 1200 Euro/mm2 (18)
0.18u HV-CMOS H18A6 1200 Euro/mm2 (18)
0.35u CMOS C35B4C3 650 Euro/mm2 (3)
0.35u CMOS Bulk Micromachining 650 Euro/mm2 (4)
  + 3700 Euro for 10 dies
0.35u CMOS C35B4M3 890 Euro/mm2 (4)
0.35u CMOS-Opto C35B4O1 810 Euro/mm2 (3)
0.35u CMOS Flash C35B4E3 800 Euro/mm2 (6)
0.35u SiGe BiCMOS S35D4M5 890 Euro/mm2 (4)
0.35u HV-CMOS H35B4D3 1000 Euro/mm2 (6)
STMicroelectronics(5)
28nm FDSOI CMOS28FDSOI 15000 Euro/mm2 (1)
(if Area less or equal to 3mm2 ) 
45000 Euro + [ (Area-3) * 12000 Euro ] 
(if 3mm2 < Area < 15mm2 ) (12)
65nm CMOS CMOS065 7500 Euro/mm2 (1)
(if Area less or equal to 5mm2 ) 
37500 Euro + [ (Area-5) * 6000 Euro ] 
(if 5mm2 < Area < 15mm2 ) (12)
130nm CMOS HCMOS9GP 2200 Euro/mm2 (1) (12)
(if Area less or equal to 20mm2 )
130nm SiGe BiCMOS9MW 3500 Euro/mm2 (1) (12) (13)
(if Area less or equal to 10mm2 ) 
4500 Euro/mm2 (1) (12) (14)
(if Area less or equal to 10mm2 )
130nm SOI H9SOI-FEM 3000 Euro + (Area * 3000 Euro/mm2) (1)
(if Area less or equal to 10mm2 ) 
30000 Euro + [ (Area-10) * 2000 Euro ] 
(if 10mm2 < Area < 25mm2 ) (12)
130nm CMOS HCMOS9A 2200 Euro/mm2 (1) (12)
(if Area less or equal to 20mm2 )
Tezzaron 3D-IC Integrated 2-tier stack 130nm CMOS 1500 Euro/mm2 (18)
MEMSCAP PolyMUMPs $ 3,700 (7) (10) (11) 
$ 4,600 (8) (10) (11)
SOI MUMPs $ 3,700 (7) (11) 
$ 4,600 (9) (11)
Metal MUMPs $ 3,700 (7) (11) 
$ 4,600 (8) (11)
PiezoMUMPs $ 3,700 (7) (11) 
$ 4,600 (8) (11)
TELEDYNE DALSA MIDIS $ 9,830 (4mm X 4mm) (2)
$18,700 (4mm X 8mm) (2)
$37,300 (8mm X 8mm) (2)


Notes:

  1. Minimum charge is the price of 1 mm2. (X*Y)
  2. Fixed size
  3. Minimum charge is the price of 3 mm2. (X*Y)
  4. Minimum charge is the price of 4 mm2. (X*Y)
  5. Area = (X + 0.24) * (Y + 0.24) mm2.
  6. Minimum charge is the price of 7 mm2. (X*Y)
  7. Price for Educational Institutions and Research Laboratories, for 15 identical chips, 1cm x 1cm (fixed size).
    For bigger chip size contact CMP.
  8. Price for Industrial Companies, for 15 identical chips 1cm x 1cm (fixed size).
  9. Price for Industrial Companies, for 15 identical chips 0,9cm x 0,9cm (fixed size).
  10. Additionnal prices for Subdicing and Release:
           - Subdicing: $ 220 per cut lane and per 15 chips,
           - HF Release: $ 870 flat rate for up to 60 die/subdie,
           - Supercritical CO2 Dry: $ 1,100 flat rate for up to 60 die/subdie.
  11. Contact CMP for multiple location prices.
  12. Contact CMP for a price quotation when Area is larger.
  13. Price for Educational Institutions and Research Laboratories.
  14. Price for Industrial Companies.
  15. Circuits must have one of the following sizes with transistor grids parallel to the Y axis (no rotation of 90°
    or of 270° for transistor cells and for diode cells). Sizes include the sawing street of 138µm:
           - X= 1000µm, Y= 1500µm
           - X= 1000µm, Y= 2000µm
           - X= 1500µm, Y= 1500µm
           - X= 1500µm, Y= 2000µm
  16. CMP will provide you with sawing street and circuit identifier.
  17. Around 50 samples are delivered on gel pack.
  18. Minimum charge is the price of 5 mm2. (X*Y).

Low Volume Production

CMP can handle, in cooperation with the silicon vendors, low volume production i.e. approximately from some dozens to some thousands pieces.
Chips are normally untested and delivered packaged or not.
If tested chips are required, CMP will help the customer to choose a testing house responding to the test specifications.
To get a quotation from CMP, send the following information about your circuit:

  • technology
  • X and Y dimensions
  • CAD tool used for the design
  • standard cell library used
  • package type
  • number of untested chips (packaged and not packaged)
  • when was the circuit prototyped (CMP run and circuit name) ?

CMP MPW Form (联系表格): To whom is interested in CMP MPW​

or please contact us directly under zhang@xmodtech.cn 

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