Globalfoundries Fabrication Schedule

Participants on Globalfoundries MPW runs must adhere to the timeline.

The Globalfoundries fabrication processes available through MOSIS include 0.35 µm,0.18 µm, 0.13 µm, 65 nm CMOS , and 28 nm CMOS processes. Access is limited to MOSIS commercial account holders who are approved by Globalfoundries. Globalfoundries MPW maximum die size allowed is 12.5 mm x 12.5 mm. To start the approval process, please send your request to the MOSIS Customer Support System.

Globalfoundries (GF) featured CMOS processes:

28 nm, 40 nm, 65 nm, 0.13 µm, 0.18  µm, and 0.35 µm.

IBM Fabrication Schedule

IBM featured processes

SiGe: 8HP (0.13 µm), 8XP (0.13 µm), and 7WL (0.18 µm) 
CMOS: 8RF-DM (0.13 µm) 

SOI: 7RF SOI (0.18 µm)

Access is limited to MOSIS commercial account holders who are approved by IBM. To create an account and request design kit and related documents, follow the IBM document access instructions. Existing accounts can skip the first step, "Commercial Account Application."

IBM Multi-Project Wafer (MPW) Run Processes

These processes are available for Multi-Project Wafer (MPW) Runs or Dedicated (COT) Runs.

IBM Dedicated Run (COT) Processes

These processes are available for Dedicated (COT) runs.

IBM Trusted Foundry Run Processes

These processes are available for Dedicated (COT) or DoD/Trusted Foundry runs.

TSMC Fabrication Schedule

TSMC featured processes

40 / 45 nm, 65 nm, 90 nm, 0.18µm, 0.35µm and TinyChip

austriamicrosystems (AMS) Fabrication Schedule

AMS featured processes:

0.18 µm in both CMOS and HV CMOS 
0.35 µm

ON Semi featured CMOS processes

I3T80 (0.35 µm), C5 (0.5 µm), and I2T100 (0.7 µm) CMOS