The IHP performs research and development in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication. The focus of research at the institute is oriented towards issues relevant for business, resulting in applications for telecommunications, semiconductor and automotive industries, aerospace, telemedicine, and automation technologies. The institute has developed into an internationally recognized competence center for silicon-germanium technologies.
The strength of the IHP is evident in the scientific contributions to leading conferences around the world, by continuous success in attaining thirdparty funds and the steadily increasing number of international users of the Multi-Project Wafer and Prototyping Services. Along with the IHP staff's exceptional competence, the cutting-edge modern technological equipment plays an important role in this success.
The IHP provides an important bridge between academia and industry. The Joint Labs with universities and universities of applied science in the Berlin-Brandenburg region have been particularly successful in this cooperation.
MPW &Prototyping: for more info->
IHP offers research partners and customers access to its powerful SiGe:C BiCMOS technologies and special integrated RF modules. The technologies are especially suited for applications in the higher GHz bands (e.g. for wireless, broadband, radar). They provide integrated HBTs with cut-off frequencies of up to 500 GHz and integrated LDMOS devices with breakdown voltages of up to 22 V, including complementary devices
Transfer of Technologies and Technology Modules:
IHP offers its 0.25 µm BiCMOS technologies and technology modules (HBT-Modules, LDMOS-Modules) for transfer. The technological parameters comply to a large extent with the parameters described above for MPW & Prototyping.
Process Module Support:
IHP offers support for advanced process modules for research and development purposes and small volume prototyping. Process modules available include:
Standard processes (implantation, etching, CMP & deposition of layer stacks such as thermal SiO2, PSG, Si3N4, Al, TiN, W);
Epitaxy (Si, Si:C, SiGe, SiGe:C);
Optical lithography (i-line and 248 nm down to 100 nm structure size);
Short-flow processing.
RF-Measurements:
IHP offers support for yield enhancement through failure mode analysis with state-of-the-art equipment, including AES, AFM, FIB, LST, SEM, SIMS, STM and TEM. Tester and equipment for RF measurements are available.
XRR and HRXRD simulation and fitting program RCRefSimW:
RCRefSimW is a state of the art program to simulate reflectivity curves (XRR) of thin layers and diffraction curves (HRXRD) of single crystals with thin strained layer structures including an automatic curve fitting procedure.
XMOD&IHP in Dotseven european project:
The DOTSEVEN project is motivated by the increasing interest in utilizing the mm-wave frequency spectrum within the so-called THz gap (which ranges from 0.3 to 30 THz, for a wide variety of applications. Examples for these applications are >120GHz industrial sensors including mm-wave scanning and radar, extremely broadband ADCs with 50 to 100GS/s and >25GHz signal bandwidth at 5 to 6 bit resolution, 400Gb/s optical (backbone) transmission, as well as highly linear amplifiers, e.g., for 4G mobile communications. These circuits and systems serve a large variety of markets either delete refs or add refs to this information such as health care and biology (e.g., medical equipment, patient monitoring, tissue and genetic screening), infrastructure and construction (e.g., structural safety), mass transportation (e.g., security screening, automotive radar, in-seat entertainment), industrial automation (e.g., sensors), communications (e.g., high-bandwidth terrestrial point-to-point wireless, satellites).
In order to reach these ambitious objectives the consortium consists of 14 partners from industry and academia in 6 European countries:
The consortium has a balanced partnership including:
Industry: Infineon Technologies AG, Dice Danube Integrated Circuit Engineering GmbH & Co KG, ALMAcg
Small/medium enterprises (SME): XMOD Technologies, SiversIMA Aktiebolag, Trebax AB
Academic & Institutional: Universita Degli Studi di Napoli Federico II, Rheinisch-Westfaelische Technische Hochschule Aachen, Technische Universitaet Dresden, Université Bordeaux I, Bergische Universitaet Wuppertal,Universitaet Linz, Technische Universiteit Delft, Innovations for High Performance Microelectronics
