The topics include, but are not limited to, the following technical areas:

 Advances in semiconductor technologies and processing (CMOS, SOI, FINFET, III-V, Wide band-gap)

 CM of passive active, sensors, and actuators

 Emerging Devices, photonic devices, CMOS, and SOI-based memory cell

 RF/Microwave device and Power device modeling

 Power device and Power integration

 Reliability modeling

 AI and machine learning in EDA & modeling application

 Nanoscale CMOS devices and circuits

 Verilog-A language for CM standardization

 New CM techniques and extraction software

 Open source TCAD/EDA modeling and simulation

 Technology R&D, DFY, DFT and IC Designs

 Chiplet Modeling and Packaging-related modeling

 Foundry/Fabless Interface Strategies

 DTCO & STCO-related EDA tools/technologies

 Other related topics