The TSMC fabrication processes available through MOSIS include
40 / 45 nm, 65 nm, 90 nm, and TinyChip
Access is limited to MOSIS commercial account holders who are approved by TSMC. To create an account and request access, follow the TSMC document access instructions. Existing accounts can proceed directly to the second step. TinyChipaccess is restricted to commercial university accounts approved by TSMC.
MOSIS offers access to the TSMC multiproject wafer (MPW) runs. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on the date listed.
TSMC design kits are available upon approval for MOSIS customers.
The Globalfoundries fabrication processes available through MOSIS include 0.35 µm,0.18 µm, 0.13 µm, 65 nm CMOS , and 28 nm CMOS processes. Access is limited to MOSIS commercial account holders who are approved by Globalfoundries. To start the approval process, please send your request to the MOSIS Customer Support System.
MOSIS offers access to the GlobalFoundriesmultiproject wafer (MPW) runs. To be considered ontime for an MPW run, refer to the Globalfoundries timeline page.
Globalfoundries MPW maximum die size allowed is 12.5 mm x 12.5 mm.
GlobalFoundries design kits are available upon approval for MOSIS customers.
The IBM fabrication processes available through MOSIS include
SiGe: 8HP (0.13 µm), 8XP (0.13 µm), and 7WL (0.18 µm)
CMOS: 8RF-DM (0.13 µm)
SOI: 7RF SOI (0.18 µm)
Access is limited to MOSIS commercial account holders who are approved by IBM. To create an account and request design kit and related documents, follow the IBM document access instructions. Existing accounts can skip the first step, "Commercial Account Application."
These processes are available for Multi-Project Wafer (MPW) Runs or Dedicated (COT) Runs.
These processes are available for Dedicated (COT) runs.
These processes are available for Dedicated (COT) or DoD/Trusted Foundry runs.
MOSIS offers a multiproject wafer (MPW) run schedule through IBM. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on the date listed.
IBM design kits are available upon approval for MOSIS customers.
The ON Semiconductor fabrication processes available through MOSIS include 0.7 µm high voltage CMOS, 0.5 µm CMOS, and 0.35 µm high voltage CMOS.
MOSIS offers access to the ON Semiconductor multiproject wafer (MPW) runs. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on the date listed.
ON Semiconductor design kits are available upon approval for MOSIS customers
The AMS fabrication schedule offered by MOSIS include 0.35 µm CMOS, high voltage CMOS, and SiGe BiCMOS processes.
MOSIS offers access to the austriamicrosystems multiproject wafer (MPW) runs. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on the date listed.
austriamicrosystems design kits are available upon approval for MOSIS customers
The imec-ePIXfab SiPhotonics fabrication processes is available through MOSIS. Access is limited to MOSIS commercial account holders who are approved by imec-ePIXfab. To start the approval process, please send your request to the MOSIS Customer Support System.
The imec-ePIXfab MPW runs are listed below. To be considered ontime for an MPW run, layout and paperwork are due to MOSIS by 1 PM PT (Pacific/California Time) on that date.
The imec-ePIXfab SiPhotonics design kit is available upon approval for approved MOSIS customers.